PT. IKEUCHI INDONESIA

Preventing ESD Damage in SMT | 7 Benefits of Dry Fog Humidification (Part 2)

Jun. 30, 2022

Table of contents

  1. 7 benefits of Dry Fog Humidification in SMT processes
  1. Preventing ESD damage(Jump to Part 1
  2. Reducing pick-and-place errors(Jump to Part 1
  3. Maintaining consistent solder print quality
  4. Reducing airborne particles
  5. Significant reduction in operating costs(Jump to Part 3
  6. Reducing cooling costs(Jump to Part 3
  7. Less sick leave(Jump to Part 3
  1. Summary | 7 benefits of Dry Fog Humidification in SMT processes

 

In surface-mount technology (SMT) processes, humidity control is essential to prevent electrostatic discharge (ESD) damage and problems with static electricity or dry air. Among all the methods to control humidity, the Dry Fog* Humidification system from IKEUCHI is the only one able to achieve all seven of these benefits.

*A fog formed out of ultrafine water droplets, each measuring 10 μm or less in diameter, which are created by specialized spray nozzles, to instantly evaporate into the air or bounce off any object instead of bursting on impact.

  1. Preventing ESD damage
  2. Reducing pick-and-place errors
  3. Maintaining consistent solder print quality
  4. Reducing airborne particles
  5. Significant reduction in operating costs
  6. Reducing cooling costs
  7. Less sick leave

In this article the main focus is on solder printing and airborne particles, in the table of contents under 3 and 4. The benefits of 1 and 2 were discussed in the previous article.

Humidity control is also essential when printing solder onto the circuit board using a metal stencil. Low humidity will cause solder to dry faster and clog the stencil openings, resulting in inadequate application of solder onto the board. This in turn has a significant impact on the reliability of solder joints.

If the humidity is too high, solder will absorb moisture resulting in excessive solder application, causing defects such as solder bridges, which lead to short circuiting, or causing components to stand up (tombstone or Manhattan phenomenon) during reflow soldering, leading to open circuits.

Appropriate humidity control helps maintain solder printing quality and product reliability. There are several methods to control humidity, but the use of this Dry Fog humidification system is very efficient due to its operating costs which will be described later.

 

Humidification suppresses airborne particles during the manufacturing process, reducing defects caused by particles adhering to the product. The table below shows the number of airborne particles measured before and after a humidity increase from 25% to 50% and clearly shows the number of particles decreasing drastically with an increase in humidity.

 

Controlling humidity in SMT processes provides seven benefits. Among all the methods to control humidity, the Dry Fog Humidification system from IKEUCHI is the only one able to achieve all of these benefits.

  1. Preventing ESD damage
  2. Reducing pick-and-place errors
  3. Maintaining consistent solder print quality
  4. Reducing airborne particles
  5. Significant reduction in operating costs
  6. Reducing cooling costs
  7. Less sick leave

Look out for additional articles. The benefits of 1 and 2 were discussed in the previous article and the next article will talk about the remaining benefits 5, 6 and 7.

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Product featured in this article

Dry Fog Humidifier | AKIMist®®

AKIMist® from IKEUCHI actively used for humidity control in a wide range of industries produces “Dry Fog”, formed out of very fine water droplets with a mean diameter of 7.5 μm or less, also called ultrafine mist or “non-wetting fog”.

Dry Fog which evaporates into air before it reaches surface of objects makes it possible to humidify a room without wetting products and equipment. Dry Fog sprayed from each nozzle, reaching over four meters, enables one unit of AKIMist® to cover a wide area.